qualcomm — community qualcomm, lib-electronic-components, community, ide skills

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关于此技能

适用于Claude Code和Cursor等AI代理,需要与Snapdragon移动平台和IoT/嵌入式系统进行流线化集成 Qualcomm MPN encoding patterns, suffix decoding, and handler guidance. Use when working with Qualcomm mobile SoCs, RF front-end, WiFi/Bluetooth, modems, or power management ICs.

Cantara Cantara
[2]
[0]
更新于: 3/18/2026

Killer-Skills Review

Decision support comes first. Repository text comes second.

Reference-Only Page Review Score: 7/11

This page remains useful for operators, but Killer-Skills treats it as reference material instead of a primary organic landing page.

Original recommendation layer Concrete use-case guidance Explicit limitations and caution
Review Score
7/11
Quality Score
33
Canonical Locale
en
Detected Body Locale
en

适用于Claude Code和Cursor等AI代理,需要与Snapdragon移动平台和IoT/嵌入式系统进行流线化集成 Qualcomm MPN encoding patterns, suffix decoding, and handler guidance. Use when working with Qualcomm mobile SoCs, RF front-end, WiFi/Bluetooth, modems, or power management ICs.

核心价值

赋予代理使用AI编码助手进行全面内容分析的能力,利用Snapdragon移动平台、IoT/嵌入式系统和RF前端解决方案(包括WiFi/蓝牙和蜂窝调制解调器),以简化开发和集成过程

适用 Agent 类型

适用于Claude Code和Cursor等AI代理,需要与Snapdragon移动平台和IoT/嵌入式系统进行流线化集成

赋予的主要能力 · qualcomm

将AI编码助手与Snapdragon移动平台集成以优化应用开发
使用高通的QCS/QCM平台分析和优化IoT/嵌入式系统的性能
使用QM、QPM、QAT和QET模块简化RF前端解决方案的开发

! 使用限制与门槛

  • 需要高通Snapdragon移动平台或IoT/嵌入式系统
  • 兼容性仅限于特定的高通RF前端解决方案
  • 依赖于WiFi/蓝牙和蜂窝调制解调器的能力

Why this page is reference-only

  • - Current locale does not satisfy the locale-governance contract.
  • - The underlying skill quality score is below the review floor.

Source Boundary

The section below is imported from the upstream repository and should be treated as secondary evidence. Use the Killer-Skills review above as the primary layer for fit, risk, and installation decisions.

评审后的下一步

先决定动作,再继续看上游仓库材料

Killer-Skills 的主价值不应该停在“帮你打开仓库说明”,而是先帮你判断这项技能是否值得安装、是否应该回到可信集合复核,以及是否已经进入工作流落地阶段。

实验室 Demo

Browser Sandbox Environment

⚡️ Ready to unleash?

Experience this Agent in a zero-setup browser environment powered by WebContainers. No installation required.

Boot Container Sandbox

常见问题与安装步骤

以下问题与步骤与页面结构化数据保持一致,便于搜索引擎理解页面内容。

? FAQ

qualcomm 是什么?

适用于Claude Code和Cursor等AI代理,需要与Snapdragon移动平台和IoT/嵌入式系统进行流线化集成 Qualcomm MPN encoding patterns, suffix decoding, and handler guidance. Use when working with Qualcomm mobile SoCs, RF front-end, WiFi/Bluetooth, modems, or power management ICs.

如何安装 qualcomm?

运行命令:npx killer-skills add Cantara/lib-electronic-components/qualcomm。支持 Cursor、Windsurf、VS Code、Claude Code 等 19+ IDE/Agent。

qualcomm 适用于哪些场景?

典型场景包括:将AI编码助手与Snapdragon移动平台集成以优化应用开发、使用高通的QCS/QCM平台分析和优化IoT/嵌入式系统的性能、使用QM、QPM、QAT和QET模块简化RF前端解决方案的开发。

qualcomm 支持哪些 IDE 或 Agent?

该技能兼容 Cursor, Windsurf, VS Code, Trae, Claude Code, OpenClaw, Aider, Codex, OpenCode, Goose, Cline, Roo Code, Kiro, Augment Code, Continue, GitHub Copilot, Sourcegraph Cody, and Amazon Q Developer。可使用 Killer-Skills CLI 一条命令通用安装。

qualcomm 有哪些限制?

需要高通Snapdragon移动平台或IoT/嵌入式系统;兼容性仅限于特定的高通RF前端解决方案;依赖于WiFi/蓝牙和蜂窝调制解调器的能力。

安装步骤

  1. 1. 打开终端

    在你的项目目录中打开终端或命令行。

  2. 2. 执行安装命令

    运行:npx killer-skills add Cantara/lib-electronic-components/qualcomm。CLI 会自动识别 IDE 或 AI Agent 并完成配置。

  3. 3. 开始使用技能

    qualcomm 已启用,可立即在当前项目中调用。

! 参考页模式

此页面仍可作为安装与查阅参考,但 Killer-Skills 不再把它视为主要可索引落地页。请优先阅读上方评审结论,再决定是否继续查看上游仓库说明。

Upstream Repository Material

The section below is imported from the upstream repository and should be treated as secondary evidence. Use the Killer-Skills review above as the primary layer for fit, risk, and installation decisions.

Upstream Source

qualcomm

安装 qualcomm,这是一款面向AI agent workflows and automation的 AI Agent Skill。查看评审结论、使用场景与安装路径。

SKILL.md
Readonly
Upstream Repository Material
The section below is imported from the upstream repository and should be treated as secondary evidence. Use the Killer-Skills review above as the primary layer for fit, risk, and installation decisions.
Supporting Evidence

Qualcomm Manufacturer Skill

Company Overview

Qualcomm is a leading fabless semiconductor company specializing in:

  • Mobile SoCs: Snapdragon mobile platforms (SM, SD, QSD, MSM series)
  • IoT/Embedded: QCS/QCM IoT platforms, APQ application processors, IPQ network processors
  • RF Front-End: RF modules (QM), power modules (QPM), antenna tuners (QAT), envelope trackers (QET)
  • Wireless Connectivity: WiFi/Bluetooth (QCA, WCN), cellular modems (MDM), small cell (FSM)
  • Power Management: PMICs (PM, PMI), battery charging (SMB)
  • Audio: Audio codecs (WCD), smart amplifiers (WSA)

MPN Structure

Qualcomm MPNs follow this general structure:

[PREFIX][SERIES][-PACKAGE]
   │       │        │
   │       │        └── Optional: Package suffix (BGA, CSP, QFN, etc.)
   │       └── Numeric series (3-4 digits)
   └── Product family prefix (SM, QCA, PM, etc.)

Example Decoding

SM8550-AB
│  │   │
│  │   └── AB = Package/variant designation
│  └── 8550 = Snapdragon 8 Gen 2 series
└── SM = Snapdragon Mobile platform

QCA6390-FCBGA
│   │    │
│   │    └── FCBGA = Flip-Chip BGA package
│   └── 6390 = Wi-Fi 6E / Bluetooth 5.2 combo chip
└── QCA = Qualcomm Connectivity/Atheros (Wi-Fi/BT)

PM8550
│  │
│  └── 8550 = Power management IC for SM8550 platform
└── PM = Power Management IC

Product Family Prefixes

Mobile Platforms (Snapdragon)

PrefixCategoryExamplesNotes
SMSnapdragon MobileSM8550, SM8450, SM8350Current flagship naming
SDSnapdragonSD888, SD865, SD855Legacy flagship naming
QSDSnapdragon (original)QSD8250, QSD8650First-gen Snapdragon
MSMMobile Station ModemMSM8996, MSM8953Integrated modem SoCs

IoT/Embedded Platforms

PrefixCategoryExamplesNotes
QCSIoT PlatformQCS400, QCS603, QCS610Smart speaker, camera, etc.
QCMIoT ModuleQCM2150, QCM6490Complete system modules
APQApplication ProcessorAPQ8064, APQ8084No integrated modem
IPQNetwork ProcessorIPQ8074, IPQ6018Routers, networking

RF Front-End

PrefixCategoryExamplesNotes
QMRF ModuleQM42195, QM78207Integrated RF front-end
QPMPower ModuleQPM2630, QPM5677PA power modules
QATAntenna TunerQAT3516, QAT3555Impedance tuning
QETEnvelope TrackerQET5100, QET6100Power efficiency

Wireless Connectivity

PrefixCategoryExamplesNotes
QCAWi-Fi/BluetoothQCA6390, QCA9377, QCA6174Atheros heritage
WCNWireless ConnectivityWCN3990, WCN6855Combo chips
MDMModemMDM9206, MDM9650Standalone modems
FSMSmall CellFSM9955, FSM9900Base station

Power Management

PrefixCategoryExamplesNotes
PMPMICPM8550, PM8350, PM8150Main PMICs
PMIPower Management ICPMI8998, PMI632Alternate PMIC series
SMBBattery ChargerSMB1360, SMB1350Charging ICs

Audio

PrefixCategoryExamplesNotes
WCDAudio CodecWCD9380, WCD9340Audio CODEC ICs
WSASmart AmplifierWSA8810, WSA8815Speaker amplifiers

Package Codes

Package codes appear after a hyphen in the MPN.

SuffixPackageFull Name
BGABGABall Grid Array
CSPCSPChip Scale Package
POP / PoPPackage-on-PackageStacked package
QFNQFNQuad Flat No-leads
PQFNPower QFNPower-rated QFN
LFCSPLead Frame CSPLead Frame Chip Scale
WLCSPWafer Level CSPSmallest footprint
FCBGAFlip-Chip BGAFlip-chip interconnect

Package Extraction Logic

The handler extracts package codes from the suffix after the last hyphen:

java
1// Direct match 2"BGA" -> "BGA" 3"CSP" -> "CSP" 4"POP" or "PoP" -> "Package-on-Package" 5"QFN" -> "QFN" 6"PQFN" -> "Power QFN" 7"LFCSP" -> "Lead Frame CSP" 8"WLCSP" -> "Wafer Level CSP" 9"FCBGA" -> "Flip-Chip BGA" 10 11// Contains check (fallback) 12Contains "BGA" -> "BGA" 13Contains "CSP" -> "CSP" 14Contains "QFN" -> "QFN"

Series Extraction Logic

The handler extracts series by collecting letters and digits before any hyphen:

java
1// Algorithm: collect alphanumerics until hyphen or end of letter+digit pattern 2SM8550-AB → SM8550 3QCA6390 → QCA6390 4PM8550 → PM8550 5MDM9650 → MDM9650

The extraction stops when:

  1. A hyphen is encountered
  2. Letters and digits have both been found, and a non-alphanumeric appears

Snapdragon Naming Evolution

Modern Naming (2021+)

SeriesTierExamples
SM8xxxFlagship (8-series)SM8550 (Gen 2), SM8650 (Gen 3)
SM7xxxPremium (7-series)SM7550, SM7450
SM6xxxMainstream (6-series)SM6350, SM6225
SM4xxxBudget (4-series)SM4350, SM4250

Legacy Naming

SeriesYearExamples
SD8xx2017-2021SD888, SD865, SD855, SD845
SD7xx2018-2021SD780, SD765, SD750
SD6xx2017-2021SD695, SD680, SD660
SD4xx2016-2021SD480, SD460, SD450
MSM89xx2014-2017MSM8996, MSM8953

Performance Tiers (Suffix Keywords)

TierKeywordDescription
EliteEliteHighest performance
PlusPlusEnhanced variant
ProProProfessional variant
Standard(none)Base variant

Generation (Suffix Keywords)

GenerationKeywordYear
Gen 1Gen12021
Gen 2Gen22022
Gen 3Gen32023

Supported ComponentTypes

The handler registers all patterns under ComponentType.IC and declares:

java
1getSupportedTypes() → { WIFI_IC_QUALCOMM }

Known Issue: The handler registers patterns for many IC categories (SoCs, modems, PMICs, etc.) but only declares WIFI_IC_QUALCOMM in getSupportedTypes(). Consider adding IC to getSupportedTypes() for completeness.


Replacement Compatibility Logic

The handler implements sophisticated replacement checking via isOfficialReplacement():

Compatible Series Pairs

Series 1Series 2Category
SD8xxSD8xxSnapdragon flagship
SM8xxSM8xxSnapdragon mobile
QCS4xxQCS4xxIoT platform
QCM2xxQCM2xxIoT module
QM4xxQM4xxRF module
QCA6xxQCA6xxWi-Fi/Bluetooth
WCN3xxWCN3xxWireless connectivity

Category-Specific Checks

Snapdragon SoCs (SM, SD, QSD, MSM):

  • Generation compatibility (higher gen can replace lower)
  • Performance tier compatibility (Elite > Plus > Pro > Standard)

Wireless Modules (QCA, WCN, MDM, FSM):

  • Wi-Fi version compatibility (WiFi-6 > WiFi-5 > WiFi-4)
  • Bluetooth version compatibility (5.2 > 5.1 > 5.0 > 4.2)

Power Management (PM, PMI, SMB):

  • Voltage rating compatibility (within 5% tolerance)
  • Current rating compatibility (higher can replace lower)

Example MPNs

Mobile SoCs

MPNDescription
SM8550-ABSnapdragon 8 Gen 2 flagship SoC
SM8450-3-ABSnapdragon 8 Gen 1 SoC
SD888Snapdragon 888 flagship (legacy naming)
MSM8996Snapdragon 820/821 SoC
QSD8250First-gen Snapdragon

IoT Platforms

MPNDescription
QCS603Vision Intelligence Platform
QCM6490IoT module with 5G
APQ8064Application processor (no modem)
IPQ8074Networking processor for routers

RF Front-End

MPNDescription
QM42195RF front-end module
QPM5677Power amplifier module
QAT3555Antenna tuner
QET6100Envelope tracking module

Wireless Connectivity

MPNDescription
QCA6390Wi-Fi 6E / Bluetooth 5.2
QCA6174A-3-FCBGAWi-Fi 5 / BT 4.2, FCBGA package
WCN6855Wi-Fi 6E combo chip
MDM9650LTE Cat-9 modem

Power Management

MPNDescription
PM8550Main PMIC for SM8550
PMI8998Power management IC
SMB1360-1-BGABattery charging IC, BGA package

Audio

MPNDescription
WCD9380Audio codec
WSA8810Smart speaker amplifier

Handler Implementation Notes

Pattern Matching

All patterns are registered under ComponentType.IC:

java
1// Mobile Platforms 2"^SM[0-9]{3}.*" // SM8550, SM7450 3"^SD[0-9]{3}.*" // SD888, SD865 4"^QSD[0-9]{4}.*" // QSD8250 5"^MSM[0-9]{4}.*" // MSM8996 6 7// IoT/Embedded 8"^QCS[0-9]{3}.*" // QCS603 9"^QCM[0-9]{3}.*" // QCM2150 10"^APQ[0-9]{4}.*" // APQ8064 11"^IPQ[0-9]{4}.*" // IPQ8074 12 13// RF Front-End 14"^QM[0-9]{4}.*" // QM42195 15"^QPM[0-9]{4}.*" // QPM5677 16"^QAT[0-9]{4}.*" // QAT3555 17"^QET[0-9]{4}.*" // QET6100 18 19// Wireless 20"^QCA[0-9]{4}.*" // QCA6390 21"^WCN[0-9]{4}.*" // WCN6855 22"^MDM[0-9]{4}.*" // MDM9650 23"^FSM[0-9]{4}.*" // FSM9955 24 25// Power Management 26"^PM[0-9]{4}.*" // PM8550 27"^PMI[0-9]{4}.*" // PMI8998 28"^SMB[0-9]{3}.*" // SMB1360 29 30// Audio 31"^WCD[0-9]{4}.*" // WCD9380 32"^WSA[0-9]{4}.*" // WSA8810

Known Issues

  1. HashSet in getSupportedTypes(): Uses HashSet instead of Set.of() - should be updated for consistency
  2. IC type not in getSupportedTypes(): Handler registers patterns for ComponentType.IC but only declares WIFI_IC_QUALCOMM - may cause matches() to return true but type not in supported set
  3. Commented-out code: Line 54 has commented-out WIFI_IC type

  • Handler: manufacturers/QualcommHandler.java
  • Component types: WIFI_IC_QUALCOMM
  • Tests: (None currently - handler needs test coverage)

Learnings & Quirks

  • PMIC naming convention: PM/PMI part numbers often match the SoC they're designed for (PM8550 pairs with SM8550)
  • Atheros heritage: QCA prefix comes from Qualcomm Atheros acquisition (2011) - Wi-Fi/Bluetooth expertise
  • Package suffix variability: Many Qualcomm parts are sold without explicit package suffix in MPN
  • Generation extraction: The handler extracts generation from 3-digit numeric portions (first digit = generation, second digit = tier)
  • Wi-Fi capability keywords: Some MPNs include "ax", "ac", "n" to indicate Wi-Fi version
  • BT version in MPN: Bluetooth version may appear as "BT5.2", "BT5.1", etc. in some variants
<!-- Add new learnings above this line -->

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